Driving
Advanced Packaging
for AI Chips

AirSEM enables the breakthroughs behind
tomorrow’s AI chip performance.

As back-end processes approach front-end resolutions,
inspection and defect review face an urgent tech gap.

AirSEM closes it,
delivering <10 nm SEM imaging
and EDX analysis on any sample,
in open air.

Monitor and inspect advanced packaging
processes without disrupting
manufacturing flow.

Any Die, Any Stack

Achieve the flexibility to analyze components and panels of any size.

Stop At Nothing

Maintain efficiency and precision in production lines with
in-situ, non-disruptive, seamless analysis.

Analyze Anything

Unlock imaging and material analysis (EDX) of 3D structures,
advanced packages, ceramics, and glass substrates outside of
vacuum environments.

SEM Set Free

AirSEM’s small footprint and overall dimensions
make it ideal for integration into second-party tools.

Practical OEM Process
Integration for
Correlative Microscopy
(Optical + SEM)

Automated Quality
Control for
Production Lines

Existing
System
Capability
Expansion
Imaging + EDX

Embrace the future of
defect analysis.

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