With over a decade of experience, Dr. Beker has successfully taken concepts from inception to market implementation. Before establishing AirSEM, he held a prominent position at B-NANO, where he led the development of the first open-air electron microscopy system. Dr. Beker holds a PhD in Physical Electronics from Tel Aviv University.

Neil Berns brings over 25 years of business and technical leadership in semiconductors, from Intel’s Technology and Manufacturing Group to early pioneering work in wafer-level, chip-scale packaging. At Applied Materials and KLA, he spearheaded high-impact GTM strategies in product and marketing leadership positions. In addition, he has been a core member of photonics startups from seed stage to series-C as well as advisor for AI startups.

Extensive expertise in thin-layer membrane development and reliability. Senior roles at Waves Audio, IAI, and Tel Aviv University; successfully managed diverse, interdisciplinary projects spanning electronics, physics, and mechanics. Holds a PhD in Microelectromechanical systems from Tel Aviv University.

Over thirty years of expertise in designing electro-magneto-mechanical vacuum systems, and developing optical, atomic, and electron microscopes. He specializes in multi-disciplinary design, integrating systems, and achieving convergence among electro-optics, optomechanics, and electronics.

Founder of IXYS Corporation the global manufacturer in the field of semiconductor-based power circuits used by more than 2500 customers worldwide. Has served as Chairman of the Board and CEO of IXYS.

Dr. Mark Wagner has 30 years of leadership in inspection and metrology. As GM of Applied Materials SEMVision, he authored the 1997 foundational patent and led its rise as the first and still market-dominant SEM defect review tool. He later pioneered aerial image inspection for masks, revitalized KLA’s metrology team in Germany, and at Nova was the first to apply machine learning to optical CD metrology in semiconductor production.

Jacob brings over 30 years of semiconductor capital equipment leadership in system engineering, and global technology programs. At Applied Materials, he led the platform integration of the Centura 300 mm system, a flagship tool with thousands of installations worldwide, and drove multiple engineering and platform initiatives that advanced next generation process technologies. He has partnered extensively with vendors, contract engineering firms, and leading semiconductor manufacturers to align technology development with market needs and accelerate commercial adoption.